| Subject area | Rank | Pctile | Q |
|---|---|---|---|
| Safety, Risk, Reliability and Quality | 273 / 282 | 3rd | Q4 |
| Metals and Alloys | 178 / 182 | 2nd | Q4 |
| Electrical and Electronic Engineering | 1007 / 1030 | 2nd | Q4 |
| Electronic, Optical and Magnetic Materials | 313 / 318 | 1st | Q4 |
| Fluid Flow and Transfer Processes | 98 / 99 | 1st | Q4 |
| Ceramics and Composites | 132 / 133 | 1st | Q4 |
International Conference on Electronic Packaging Technology, ICEPT
ISSN 2836-9734
Publisher: Institute of Electrical and Electronics Engineers Inc.
Is International Conference on Electronic Packaging Technology, ICEPT indexed in Scopus? Yes — actively indexed in Scopus, coverage 2025, best quartile Q4, CiteScore 0.
Is International Conference on Electronic Packaging Technology, ICEPT in Web of Science? No — it is not currently in the Web of Science core collections (SCIE, SSCI, AHCI or ESCI).
Is International Conference on Electronic Packaging Technology, ICEPT open access? No — it is not registered as an open-access journal in DOAJ or Scopus.
Official sources & links
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Index data is curated from public sources (Scopus, Web of Science, ABDC, FT50, UT Dallas, DOAJ). CiteScore and quartiles reflect the latest available Scopus release. Always verify a journal's current status on its official source before submitting.