ISSN 2768-1874 · 2836-8487
Publisher: Institute of Electrical and Electronics Engineers Inc.
Is Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP indexed in Scopus? Yes — actively indexed in Scopus, coverage 2025, best quartile Q4, CiteScore 0.1.
Is Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP in Web of Science? No — it is not currently in the Web of Science core collections (SCIE, SSCI, AHCI or ESCI).
Is Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP open access? No — it is not registered as an open-access journal in DOAJ or Scopus.
| Subject area | Rank | Pctile | Q |
|---|---|---|---|
| Control and Optimization | 174 / 198 | 12th | Q4 |
| Instrumentation | 190 / 206 | 8th | Q4 |
| Safety, Risk, Reliability and Quality | 260 / 282 | 7th | Q4 |
| Electrical and Electronic Engineering | 983 / 1030 | 4th | Q4 |
| Electronic, Optical and Magnetic Materials | 308 / 318 | 3rd | Q4 |
Index data is curated from public sources (Scopus, Web of Science, ABDC, FT50, UT Dallas, DOAJ). CiteScore and quartiles reflect the latest available Scopus release. Always verify a journal's current status on its official source before submitting.