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Journal of Electronic Packaging is Scopus-indexed (Q1, CiteScore 6.6), WoS SCIE. It is covered by India's One Nation One Subscription scheme for reading access. Published by American Society of Mechanical Engineers (ASME).
Checked against the index lists dated .
ISSN 1043-7398Verify ISSN ↗1528-9044Verify ISSN ↗
Publisher: American Society of Mechanical Engineers (ASME)
Cost to publish: No APC data — check the publisher
| Subject area | Rank | Pctile | Q |
|---|---|---|---|
| Electrical and Electronic Engineering | 231 / 1030 | 77th | Q1 |
| Mechanics of Materials | 99 / 408 | 75th | Q1 |
| Electronic, Optical and Magnetic Materials | 81 / 318 | 74th | Q2 |
| Computer Science Applications | 270 / 1022 | 73rd | Q2 |
Not listed in: DOAJ, ABDC, ABS / AJG, FT50, UT Dallas, ONOS (APC covered)
Yes — actively indexed in Scopus, coverage 1989–present, best quartile Q1, CiteScore 6.6.
Journal of Electronic Packaging is Q1 in Electrical and Electronic Engineering (rank 231 of 1030), Q1 in Mechanics of Materials (rank 99 of 408) and Q2 in Electronic, Optical and Magnetic Materials (rank 81 of 318), by CiteScore 2025. It is ranked in 4 subject areas in all.
Journal of Electronic Packaging is indexed in the Science Citation Index Expanded, so it may have a Journal Impact Factor in Clarivate's Journal Citation Reports. JCR is paid, so check it for the current value. The closest free measure is its Scopus CiteScore 6.6, which places it in quartile Q1 at the 77th percentile of its subject. Its SCImago Journal Rank (SJR, a free Scopus-based metric) is 0.497, quartile Q2, with an H-index of 68.
Journal of Electronic Packaging is published by American Society of Mechanical Engineers (ASME). Its print ISSN is 1043-7398 and its online ISSN is 1528-9044.
Yes. It is part of the One Nation One Subscription (ONOS) national subscription, so readers at participating Indian institutions get its full text. ONOS does not cover its article processing charge.
Yes — indexed in the Science Citation Index Expanded.
No — it is not registered as an open-access journal in DOAJ or Scopus.
Journal of Electronic Packaging has an h-index of 81 and a 2-year mean of 2.43 citations per paper (OpenAlex). Its Scopus CiteScore is 6.6, quartile Q1. On 2-year citations it ranks #308 of 744 Scopus journals in Electrical and Electronic Engineering.
Journal of Electronic Packaging published 54 papers in 2025; its busiest recent year was 2020 with 87. 2026* is the year so far.
h-index, i10-index and 2-year mean citedness are open, licence-clear metrics from OpenAlex — not a proprietary impact factor. The subject rank counts only journals that OpenAlex has a figure for; it is not a Scopus or Clarivate ranking. Updated 2026-10-14.
In its latest 95 research articles (2025–2026), authors are most often from United States (51.9%), China (15.8%) and South Korea (5.3%). More than half of recent authorship comes from one country.
Countries are counted fractionally, so a paper by authors from two countries counts half to each.
Scopus status: Active. No retracted papers are recorded. The Problematic Paper Screener flags none of its papers. These are indicators to check, not findings against the journal.
Retractions from OpenAlex; flags from the Problematic Paper Screener (Cabanac, Labbé & Magazinov, CC BY), 2026-09-21 export. A flag marks a paper for a closer look; it is not a finding against the journal.
Index data is curated from public sources (Scopus, Web of Science, ABDC, FT50, UT Dallas, DOAJ). CiteScore and quartiles reflect the latest available Scopus release. Always verify a journal's current status on its official source before submitting.
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