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Proceedings of the IEEE International Multi Topic Conference, INMIC

ISSN 2835-8848 · 2835-8864

Publisher: Institute of Electrical and Electronics Engineers Inc.

Scopus · Q3

Is Proceedings of the IEEE International Multi Topic Conference, INMIC indexed in Scopus? Yes — actively indexed in Scopus, coverage 2024, best quartile Q3, CiteScore 0.9.

Is Proceedings of the IEEE International Multi Topic Conference, INMIC in Web of Science? No — it is not currently in the Web of Science core collections (SCIE, SSCI, AHCI or ESCI).

Is Proceedings of the IEEE International Multi Topic Conference, INMIC open access? No — it is not registered as an open-access journal in DOAJ or Scopus.

0.9
CiteScore 2025
Scopus
Q3
Best quartile
35th percentile
1
Indexed in
major index
ScopusElsevier Scopus
Status
Active
Coverage
2024
Source type
Journal
Open access
No
CiteScore
0.9
Best quartile
Q3 · 35th pctile
Subject areaRankPctileQ
Control and Optimization129 / 19835thQ3
Instrumentation147 / 20628thQ3
Energy Engineering and Power Technology263 / 34724thQ4
Artificial Intelligence438 / 57023rdQ4
Computer Vision and Pattern Recognition144 / 18321stQ4
Modeling and Simulation321 / 39719thQ4
Computer Science Applications863 / 102215thQ4
Ceramics and Composites115 / 13313thQ4
View this source on Scopus.com
Web of ScienceClarivate (SCIE/SSCI/AHCI/ESCI)
Not listed in Web of Science.
ABDCAustralian Business Deans Council 2025
Not listed in ABDC.
DOAJDirectory of Open Access Journals (live)
Checking DOAJ…
FT50Financial Times research list
Not listed in FT50.
UT DallasUTD top-100 business research
Not listed in UT Dallas.
ONOS · APC coveredOne Nation One Subscription (Govt of India)
Not in the ONOS APC-supported list.
Publishing in this journal is not centrally APC-funded under One Nation One Subscription.

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Index data is curated from public sources (Scopus, Web of Science, ABDC, FT50, UT Dallas, DOAJ). CiteScore and quartiles reflect the latest available Scopus release. Always verify a journal's current status on its official source before submitting.